Brewer Science, EV Group Jointly Develop ZoneBOND Technology for Temporary Wafer Bonding

rewer Science and EV Group sign an agreement for the joint development and commercialization of the ZoneBOND technology for temporary wafer bonding. According to the agreement both parties will actively work towards making the ZoneBOND technology commercially available for the customers of the temporary wafer bonding market. The ZoneBOND technology is an innovative approach in the area of temporary wafer bonding, debonding and thin wafer processing.