Gary D Watson
Examiner (ID: 14962)
Most Active Art Unit | 2913 |
Art Unit(s) | 2899, 2915, 2903, 2914, 2913 |
Total Applications | 3888 |
Issued Applications | 3853 |
Pending Applications | 0 |
Abandoned Applications | 35 |
Applications
Application number | Title of the application | Filing Date | Status |
---|---|---|---|
Array
(
[id] => 4176866
[patent_doc_number] => 06140698
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2000-10-31
[patent_title] => 'Package for microwave and mm-wave integrated circuits'
[patent_app_type] => 1
[patent_app_number] => 9/217059
[patent_app_country] => US
[patent_app_date] => 1998-12-21
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 6
[patent_no_of_words] => 2807
[patent_no_of_claims] => 35
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 251
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/140/06140698.pdf
[firstpage_image] =>[orig_patent_app_number] => 217059
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/217059 | Package for microwave and mm-wave integrated circuits | Dec 20, 1998 | Issued |
Array
(
[id] => 4104336
[patent_doc_number] => 06119325
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2000-09-19
[patent_title] => 'High pressure water stream to separate a multi-layer integrated circuit device and package'
[patent_app_type] => 1
[patent_app_number] => 9/199889
[patent_app_country] => US
[patent_app_date] => 1998-11-24
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 1
[patent_figures_cnt] => 3
[patent_no_of_words] => 1103
[patent_no_of_claims] => 14
[patent_no_of_ind_claims] => 5
[patent_words_short_claim] => 58
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/119/06119325.pdf
[firstpage_image] =>[orig_patent_app_number] => 199889
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/199889 | High pressure water stream to separate a multi-layer integrated circuit device and package | Nov 23, 1998 | Issued |
Array
(
[id] => 4097400
[patent_doc_number] => 06048740
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2000-04-11
[patent_title] => 'Ferroelectric nonvolatile transistor and method of making same'
[patent_app_type] => 1
[patent_app_number] => 9/187238
[patent_app_country] => US
[patent_app_date] => 1998-11-05
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 10
[patent_no_of_words] => 2617
[patent_no_of_claims] => 14
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[patent_words_short_claim] => 252
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/048/06048740.pdf
[firstpage_image] =>[orig_patent_app_number] => 187238
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/187238 | Ferroelectric nonvolatile transistor and method of making same | Nov 4, 1998 | Issued |
Array
(
[id] => 4235176
[patent_doc_number] => 06143588
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2000-11-07
[patent_title] => 'Method of making an integrated circuit package employing a transparent encapsulant'
[patent_app_type] => 1
[patent_app_number] => 9/176048
[patent_app_country] => US
[patent_app_date] => 1998-10-20
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 4
[patent_no_of_words] => 4377
[patent_no_of_claims] => 46
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 173
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/143/06143588.pdf
[firstpage_image] =>[orig_patent_app_number] => 176048
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/176048 | Method of making an integrated circuit package employing a transparent encapsulant | Oct 19, 1998 | Issued |
Array
(
[id] => 3989469
[patent_doc_number] => 05959311
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1999-09-28
[patent_title] => 'Structure of an antenna effect monitor'
[patent_app_type] => 1
[patent_app_number] => 9/172459
[patent_app_country] => US
[patent_app_date] => 1998-10-14
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 1
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[patent_no_of_words] => 2493
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[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/959/05959311.pdf
[firstpage_image] =>[orig_patent_app_number] => 172459
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/172459 | Structure of an antenna effect monitor | Oct 13, 1998 | Issued |
Array
(
[id] => 4107165
[patent_doc_number] => 06057177
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2000-05-02
[patent_title] => 'Reinforced leadframe to substrate attachment'
[patent_app_type] => 1
[patent_app_number] => 9/158328
[patent_app_country] => US
[patent_app_date] => 1998-09-22
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
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[patent_no_of_words] => 2360
[patent_no_of_claims] => 9
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[patent_words_short_claim] => 228
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/057/06057177.pdf
[firstpage_image] =>[orig_patent_app_number] => 158328
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/158328 | Reinforced leadframe to substrate attachment | Sep 21, 1998 | Issued |
Array
(
[id] => 4183416
[patent_doc_number] => 06159826
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2000-12-12
[patent_title] => 'Semiconductor wafer and fabrication method of a semiconductor chip'
[patent_app_type] => 1
[patent_app_number] => 9/154579
[patent_app_country] => US
[patent_app_date] => 1998-09-17
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 9
[patent_no_of_words] => 2285
[patent_no_of_claims] => 10
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 192
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/159/06159826.pdf
[firstpage_image] =>[orig_patent_app_number] => 154579
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/154579 | Semiconductor wafer and fabrication method of a semiconductor chip | Sep 16, 1998 | Issued |
Array
(
[id] => 4070721
[patent_doc_number] => 06008535
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1999-12-28
[patent_title] => 'Method of making a semiconductor diode from laminated ceramic tape'
[patent_app_type] => 1
[patent_app_number] => 9/154578
[patent_app_country] => US
[patent_app_date] => 1998-09-17
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
[patent_figures_cnt] => 3
[patent_no_of_words] => 1636
[patent_no_of_claims] => 7
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 117
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/008/06008535.pdf
[firstpage_image] =>[orig_patent_app_number] => 154578
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/154578 | Method of making a semiconductor diode from laminated ceramic tape | Sep 16, 1998 | Issued |
Array
(
[id] => 4083349
[patent_doc_number] => 06162651
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2000-12-19
[patent_title] => 'Method and system for accurately marking the backside of the die for fault location isolation'
[patent_app_type] => 1
[patent_app_number] => 9/153758
[patent_app_country] => US
[patent_app_date] => 1998-09-15
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
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[patent_no_of_words] => 3765
[patent_no_of_claims] => 16
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[patent_words_short_claim] => 167
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[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/162/06162651.pdf
[firstpage_image] =>[orig_patent_app_number] => 153758
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/153758 | Method and system for accurately marking the backside of the die for fault location isolation | Sep 14, 1998 | Issued |
Array
(
[id] => 3952977
[patent_doc_number] => 05998840
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1999-12-07
[patent_title] => 'Semiconductor-on-insulator field effect transistors with reduced floating body parasitics'
[patent_app_type] => 1
[patent_app_number] => 9/148689
[patent_app_country] => US
[patent_app_date] => 1998-09-04
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 6
[patent_no_of_words] => 2166
[patent_no_of_claims] => 12
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 67
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[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/998/05998840.pdf
[firstpage_image] =>[orig_patent_app_number] => 148689
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/148689 | Semiconductor-on-insulator field effect transistors with reduced floating body parasitics | Sep 3, 1998 | Issued |
09/146528 | INDUCTOR DEVICE ON A SILICON SUBSTRATE AND MANUFACTURING METHOD THEREOF | Sep 2, 1998 | Abandoned |
Array
(
[id] => 3993355
[patent_doc_number] => 05985695
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1999-11-16
[patent_title] => 'Method of making a molded flex circuit ball grid array'
[patent_app_type] => 1
[patent_app_number] => 9/141928
[patent_app_country] => US
[patent_app_date] => 1998-08-28
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 8
[patent_no_of_words] => 4947
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[pdf_file] => patents/05/985/05985695.pdf
[firstpage_image] =>[orig_patent_app_number] => 141928
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/141928 | Method of making a molded flex circuit ball grid array | Aug 27, 1998 | Issued |
Array
(
[id] => 4218660
[patent_doc_number] => 06040204
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2000-03-21
[patent_title] => 'Method of stacking chips with a removable connecting layer'
[patent_app_type] => 1
[patent_app_number] => 9/143309
[patent_app_country] => US
[patent_app_date] => 1998-08-28
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[pdf_file] => patents/06/040/06040204.pdf
[firstpage_image] =>[orig_patent_app_number] => 143309
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/143309 | Method of stacking chips with a removable connecting layer | Aug 27, 1998 | Issued |
Array
(
[id] => 3928688
[patent_doc_number] => 05989106
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1999-11-23
[patent_title] => 'Ferrule for use with an optical fiber connector and method for production thereof'
[patent_app_type] => 1
[patent_app_number] => 9/140598
[patent_app_country] => US
[patent_app_date] => 1998-08-26
[patent_effective_date] => 0000-00-00
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[pdf_file] => patents/05/989/05989106.pdf
[firstpage_image] =>[orig_patent_app_number] => 140598
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/140598 | Ferrule for use with an optical fiber connector and method for production thereof | Aug 25, 1998 | Issued |
Array
(
[id] => 4184533
[patent_doc_number] => 06037667
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2000-03-14
[patent_title] => 'Socket assembly for use with solder ball'
[patent_app_type] => 1
[patent_app_number] => 9/139168
[patent_app_country] => US
[patent_app_date] => 1998-08-24
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 16
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[patent_no_of_words] => 9434
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/037/06037667.pdf
[firstpage_image] =>[orig_patent_app_number] => 139168
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/139168 | Socket assembly for use with solder ball | Aug 23, 1998 | Issued |
Array
(
[id] => 3953077
[patent_doc_number] => 05998847
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1999-12-07
[patent_title] => 'Low voltage active body semiconductor device'
[patent_app_type] => 1
[patent_app_number] => 9/132599
[patent_app_country] => US
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[pdf_file] => patents/05/998/05998847.pdf
[firstpage_image] =>[orig_patent_app_number] => 132599
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/132599 | Low voltage active body semiconductor device | Aug 10, 1998 | Issued |
Array
(
[id] => 4187289
[patent_doc_number] => 06020628
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2000-02-01
[patent_title] => 'Optical component package with a hermetic seal'
[patent_app_type] => 1
[patent_app_number] => 9/118638
[patent_app_country] => US
[patent_app_date] => 1998-07-17
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/020/06020628.pdf
[firstpage_image] =>[orig_patent_app_number] => 118638
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/118638 | Optical component package with a hermetic seal | Jul 16, 1998 | Issued |
Array
(
[id] => 4148119
[patent_doc_number] => 06031281
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2000-02-29
[patent_title] => 'Semiconductor integrated circuit device having dummy bonding wires'
[patent_app_type] => 1
[patent_app_number] => 9/115828
[patent_app_country] => US
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[pdf_file] => patents/06/031/06031281.pdf
[firstpage_image] =>[orig_patent_app_number] => 115828
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/115828 | Semiconductor integrated circuit device having dummy bonding wires | Jul 14, 1998 | Issued |
Array
(
[id] => 4236599
[patent_doc_number] => 06090638
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2000-07-18
[patent_title] => 'Process for manufacturing high-sensitivity capacitive and resonant integrated sensors, particularly accelerometers and gyroscopes, and sensors made therefrom'
[patent_app_type] => 1
[patent_app_number] => 9/113979
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[pdf_file] => patents/06/090/06090638.pdf
[firstpage_image] =>[orig_patent_app_number] => 113979
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/113979 | Process for manufacturing high-sensitivity capacitive and resonant integrated sensors, particularly accelerometers and gyroscopes, and sensors made therefrom | Jul 9, 1998 | Issued |
Array
(
[id] => 3933894
[patent_doc_number] => 05997589
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1999-12-07
[patent_title] => 'Adjustment pumping plate design for the chamber of semiconductor equipment'
[patent_app_type] => 1
[patent_app_number] => 9/113018
[patent_app_country] => US
[patent_app_date] => 1998-07-09
[patent_effective_date] => 0000-00-00
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[pdf_file] => patents/05/997/05997589.pdf
[firstpage_image] =>[orig_patent_app_number] => 113018
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/113018 | Adjustment pumping plate design for the chamber of semiconductor equipment | Jul 8, 1998 | Issued |